Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fa- tigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy （SEM） in-situ technology and nonlinear finite element modeling, respec- tively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.     

一维六方准晶压电材料中幂函数型曲线裂纹的反平面问题

依据一维六方准晶压电材料反平面问题的基本方程,利用复变函数方法,通过引入适当的保角映射,研究了一维六方准晶压电材料中幂函数型曲线裂纹的反平面问题,并利用Cauchy积分理论,得到电不可通和电可通边界条件下的应力场和位移场的复表示以及裂纹尖端场强度因子的解析表达式.     

Numerical solution of a singular integral equation arising in a cruciform crack problem

A singular integral equation arising in a cruciform crack problem is investigated in the present paper. Based on the convex technique, the piecewise Taylor-series expansion method is extended by introducing a weight parameter. An approximate solution of the singular integral equation is constructed and its convergence and error estimate are made. The variations of the approximate solutions associating with stress intensity factors are analyzed by considering internal pressures of power and sine functions, respectively. By comparing with the known methods, the observations reveal that a good approximation can be achieved using less derivative times, less discretization points, and a suitable weight parameter. The obtained results show that the crack growth is dependent on applied mechanical loadings.     

T300/648迭层板接头挤压疲劳损伤参数的选择与测定

本文对碳纤维增强复合材料迭层板(C.F.R.P)接头在不同环境条件下的挤压疲劳损伤扩展进行了实验研究.并根据“剩余强度,剩余刚度”理论和“疲劳模量”概念,讨论了接头的刚度下降和强度变化.由此提出了“损伤参数”D的定义和测量方法;并对损伤试件,进行了X射线检测分析,验证了累积损伤的扩展.     

V型缺口裂端的三维应力状态及约束分析

利用三维有限元方法，研究了有限厚度板中V型缺口根部穿透裂纹前沿的三维弹性应力场。对不同厚度、不同缺口张开角和裂纹长度对应力强度因子及裂尖附近的三维约束程度的影响进行了分析，同时还讨论了三维约束区的大小。研究结果显示：当缺口张开角小于60度时，不同缺口的应力强度因子和离面约束因子的分布基本一致，角度的影响不明显。应力强度因子是厚度的函数，板中面的应力强度因子随厚度的增加逐渐减小趋近干平面值，最大为1．08倍的平面值。当板厚超过15倍的缺口深度时，应力强度因子最大值将从中面转移至接近自由表面位置，距中面约0．4倍板厚。三维约束非常明显的区域在裂尖前沿约0.45倍厚度的范围内．二维到三维的过渡区在裂尖前沿1.5倍厚度的区域内；在中面上三维效应影响区最大，随着离中面距离的增加逐渐减小，在自由表面上降为0。     

Three-Dimensional Dynamic Contact Problem for an Elliptic Crack Interacting with a Normally Incident Harmonic Compression–Expansion Wave

The paper deals with the three-dimensional dynamic problem for an elliptic crack interacting with a normally incident harmonic compression–expansion wave, considering the contact interaction of the crack faces. An asymmetric solution is obtained using an iteration algorithm developed earlier. Numerical results are presented     

A DECAGONAL QUASICRYSTAL WITH AN ARC-SHAPED CRACK

A decagonal quasicrystal,which is weakened by an arc-shaped crack penetratingthrough the solid in the period direction,and which is subjected to remote uniform phonon stresses,is investigated by applying the complex variable method which is just developed by the authors.It is found that the phonon and phason stresses near the crack tips exhibit inverse square rootsingularities.The four complex stress functions characterizing the phonon and phason fields arederived.Explicit expressions for the phonon and phason stress intensity factors,crack openingdisplacements and energy release rate are also presented.     

软夹硬力学不均匀焊接接头疲劳裂纹闭合行为的实验研究

力学性能不均匀是焊接接头的三大待征之一，本文采用柔度法研究了不同硬夹层宽度的软夹硬力学不均匀焊接接头疲劳裂纹的闭俣行为。研究结果表明，裂纹尖端附近软区的局部屈服在疲劳载荷卸载过程中促使裂纹闭合。随着硬夹层宽度的减小，这一影响越来越明显。     

Defect assessment procedure based on ductile tearing process

Strain hardening, crack growth resistance and nonuniform load distribution have significant effects on the ductile tearing process. A defect assessment procedure incorporating with the above features is proposed in the present paper, with the final appearance of “design curves” to facilitate engineering applications.     

On the influence of singular-type finite elements on the critical force in studying the buckling of a circular plate with a crack

The axisymmetric buckling (delamination) of a circular disk (plate) with a penny-shaped crack is analyzed using a continuum model, piecewise-homogeneous model, and the three-dimensional linearized theory of stability. The FEM is used. The analysis is carried out using various singular and ordinary finite elements. The numerical results obtained indicate that it is not necessary to use singular finite elements to solve the problem Published in Prikladnaya Mekhanika, Vol. 43, No. 9, pp. 120–129, September 2007.